Solder Paste
Solder Paste

Solder Paste

Price 2500 INR/ Piece

MOQ : 10 Pieces

Solder Paste Specification

  • Used For
  • PCB Soldering, SMT and Electronic Assembly
  • Operate Method
  • Manual or Automated Dispensers
  • Product Type
  • Solder Paste
  • Usage
  • Surface Mount Technology (SMT), Manual and Automatic Soldering applications
  • Size
  • 500g (typical jar)
  • Material
  • Tin/Lead Alloy, Flux
  • Color
  • Grey, Silver
  • Storage Conditions
  • Store at 210C (Refrigerated)
  • Packaging Type
  • Jar, Cartridge, or Syringe
  • Suitable For
  • SMT Components, Fine Pitch, BGA, CSP, QFP, etc.
  • Tackiness
  • Medium to High for stencil printing
  • Application Method
  • Stencil Printing, Dispensing, or Syringe Application available
  • Alloy Composition
  • Sn63/Pb37 (63% Tin, 37% Lead) or Lead-Free options available
  • Viscosity
  • 800,000 1,400,000 cps (dependent on type)
  • Shelf Life
  • 6-12 months under refrigerated conditions
  • Flux Type
  • No-clean, Rosin-based
  • Melting Point
  • 183C (for Tin/Lead alloy)
  • Particle Size
  • Type 3 or Type 4 Spheres
 
 

About Solder Paste



Discover a hot deal on illustrious Solder Paste, renowned for superior performance in SMT, fine pitch, BGA, CSP, and QFP assembly. This grandiose paste, available in highlighted Sn63/Pb37 alloy or lead-free variants, melts sharply at 183C, offering premium no-clean, rosin-based flux. With medium to high tackiness and versatile viscosity, its ideal for stencil printing, dispensing, or syringe applications. Packaged in jars, cartridges, or syringes, this bargain product is perfect for PCB soldering, SMT, and electronic assembly. Distributors, suppliers, importers, and traders across India trust its impeccable quality.

Optimized Solder Paste for Diverse Applications

Solder Paste is specifically designed for surface mount technology (SMT) and electronic assembly sites. It excels in fine pitch, BGA, CSP, and QFP components, making it a highlighted solution for both manual and automated dispensers. Used for PCB soldering, its grandiose formulation supports SMT applications and ensures precise, reliable results. Whether for prototype builds or high-volume production, its adaptability provides astounding value in manufacturing and repair operations.


Flexible Payment and Swift Market Reach

Experience hassle-free transactions with our solder paste, which supports various payment terms for your convenience. Quick Dispatch and Secure Shipping are our priorities, making the process seamless from quotation to final delivery. We serve the grand domestic market of India, along with illustrious export markets worldwide, ensuring clients receive their orders promptly and securely, backed by our renowned customer support.


FAQs of Solder Paste:


Q: How can Solder Paste be used in electronic assembly applications?

A: Solder Paste is applied through stencil printing, dispensing, or syringe methods, making it highly effective for surface mount technology (SMT) assemblies such as PCB, BGA, CSP, and QFP components. It caters to both manual and automated assembly lines.

Q: What are the storage requirements for maintaining Solder Paste quality?

A: Store Solder Paste between 210C under refrigerated conditions. Ensuring consistent refrigeration preserves its optimum viscosity and prolongs shelf life, typically between 6 to 12 months.

Q: When is the best time to use a fresh batch of Solder Paste?

A: For best results, use Solder Paste within its recommended shelf life of 6-12 months. Always inspect the packaging date and adhere to storage guidelines to retain its grandiose performance and prevent degradation.

Q: Where is this Solder Paste suitable for application?

A: This Solder Paste is suitable for SMT component assembly sites, PCB manufacturing units, repair centers, and electronic assembly plants. Its versatile application method suits diverse industrial settings.

Q: What are the main benefits of using this Solder Paste in SMT processes?

A: The illustrious formulation allows for medium to high tackiness optimal for stencil printing, rapid melting at 183C, and a no-clean, rosin-based flux that minimizes residue. These features assure reliable solder joints and efficient production workflows.

Q: How do I select between Sn63/Pb37 and lead-free variants of Solder Paste?

A: Selection depends on the application requirements and environmental regulations. Sn63/Pb37 offers a proven performance profile with a 183C melting point, while lead-free options are preferred where RoHS compliance or lead-free processes are mandated.

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